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Date: Mon, 7 Jul 2025 07:13:29 +0800
To: editorial <editorial@businessedge.news>
From: Lion <Lion@xkh-semi.com>
Subject: High-Precision Laser Dicing System | Reduce Microcracks & Tool Wear for SiC/Compound Wafers
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.loaderrorclass{display:inline-block;cursor:default;background: Url('https:=
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ound: Url('https://fob.ai.cc/assets/plugins/ueditor/themes/default/images/a=
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Inline-block;height: 16px;width: 15px;}</style><style type=3D"text/css">bod=
y{background-color:#ffffff; Background-image:; Background-repeat:repeat; Ba=
ckground-position:0% 0%; Height:507px; }</style> </head><body ><p style=3D"=
margin-top:7px;margin-right:0;margin-bottom:7px;margin-left:0;margin-top:au=
to;margin-bottom:auto"><span style=3D";font-family:Calibri;font-size:16px">=
Dear Editorial,</span></p><p style=3D"margin-top:7px;margin-right:0;margin-=
bottom:7px;margin-left:0;margin-top:auto;margin-bottom:auto;text-align:left=
"><span style=3D";font-family:Calibri;font-size:16px">I=E2=80=99m reaching =
out from</span><span style=3D";font-family:=E5=AE=8B=E4=BD=93;font-size:16p=
x">&nbsp;<span style=3D"font-family:Calibri">ZMSH</span></span><span style=
=3D";font-family:Calibri;font-size:16px">, a solution provider focused on a=
dvanced wafer processing equipment.</span></p><p style=3D"margin-top:7px;ma=
rgin-right:0;margin-bottom:7px;margin-left:0;margin-top:auto;margin-bottom:=
auto;text-align:left"><span style=3D";font-family:Calibri;font-size:16px">I=
n our work with customers in semiconductor and materials-related industries=
, we=E2=80=99ve noticed that many face </span><strong><span style=3D";font-=
family:Calibri">growing challenges in dicing hard or brittle wafers</span><=
/strong><span style=3D";font-family:Calibri;font-size:16px">&nbsp;such as S=
iC, sapphire, and compound semiconductors. These include:</span></p><p styl=
e=3D"margin-top:7px;margin-right:0;margin-bottom:7px;margin-left:28px;margi=
n-top:auto;margin-bottom:auto;text-align:left"><span style=3D"font-family:W=
ingdings;font-size:16px">l&nbsp;</span><span style=3D";font-family:Calibri;=
font-size:16px">Mechanical blade dicing causing microcracks, chipping, or y=
ield loss</span></p><p style=3D"margin-top:7px;margin-right:0;margin-bottom=
:7px;margin-left:28px;margin-top:auto;margin-bottom:auto;text-align:left"><=
span style=3D"font-family:Wingdings;font-size:16px">l&nbsp;</span><span sty=
le=3D";font-family:Calibri;font-size:16px">Limited flexibility with varying=
 wafer thicknesses or small batches</span></p><p style=3D"margin-top:7px;ma=
rgin-right:0;margin-bottom:7px;margin-left:28px;margin-top:auto;margin-bott=
om:auto;text-align:left"><span style=3D"font-family:Wingdings;font-size:16p=
x">l&nbsp;</span><span style=3D";font-family:Calibri;font-size:16px">High t=
ool wear and maintenance costs under long-term usage</span></p><p style=3D"=
margin-top:7px;margin-right:0;margin-bottom:7px;margin-left:28px;margin-top=
:auto;margin-bottom:auto;text-align:left"><span style=3D"font-family:Wingdi=
ngs;font-size:16px">l&nbsp;</span><span style=3D";font-family:Calibri;font-=
size:16px">Difficulty in achieving precision cuts for thin or composite waf=
ers</span></p><p style=3D"margin-top:7px;margin-right:0;margin-bottom:7px;m=
argin-left:0;margin-top:auto;margin-bottom:auto;text-align:left"><span styl=
e=3D";font-family:Calibri;font-size:16px">To help address these issues, we =
offer a </span><strong><span style=3D";font-family:Calibri">wafer laser dic=
ing system</span></strong><span style=3D";font-family:Calibri;font-size:16p=
x">&nbsp;designed for high precision, low-damage cutting across a wide rang=
e of materials, including:</span></p><p style=3D"margin-top:7px;margin-righ=
t:0;margin-bottom:7px;margin-left:28px;margin-top:auto;margin-bottom:auto;t=
ext-align:left"><span style=3D"font-family:Calibri;font-size:16px">1.&nbsp;=
</span><span style=3D";font-family:Calibri;font-size:16px">SiC, sapphire, G=
aN, Si, and compound wafers (thickness up to 1mm)</span></p><p style=3D"mar=
gin-top:7px;margin-right:0;margin-bottom:7px;margin-left:28px;margin-top:au=
to;margin-bottom:auto;text-align:left"><span style=3D"font-family:Calibri;f=
ont-size:16px">2.&nbsp;</span><span style=3D";font-family:Calibri;font-size=
:16px">Full-size support up to 12=E2=80=9D wafers, with edge protection fea=
tures</span></p><p style=3D"margin-top:7px;margin-right:0;margin-bottom:7px=
;margin-left:28px;margin-top:auto;margin-bottom:auto;text-align:left"><span=
 style=3D"font-family:Calibri;font-size:16px">3.&nbsp;</span><span style=3D=
";font-family:Calibri;font-size:16px">Non-contact cutting, reducing stress =
and improving die strength</span></p><p style=3D"margin-top:7px;margin-righ=
t:0;margin-bottom:7px;margin-left:28px;margin-top:auto;margin-bottom:auto;t=
ext-align:left"><span style=3D"font-family:Calibri;font-size:16px">4.&nbsp;=
</span><span style=3D";font-family:Calibri;font-size:16px">Customizable par=
ameters for different materials and processing needs</span></p><p style=3D"=
margin-top:7px;margin-right:0;margin-bottom:7px;margin-left:28px;margin-top=
:auto;margin-bottom:auto;text-align:left"><span style=3D"font-family:Calibr=
i;font-size:16px">5.&nbsp;</span><span style=3D";font-family:Calibri;font-s=
ize:16px">Sample dicing and process evaluation available upon request</span=
></p><p style=3D"margin-top:7px;margin-right:0;margin-bottom:7px;margin-lef=
t:0;margin-top:auto;margin-bottom:auto;text-align:left"><span style=3D";fon=
t-family:Calibri;font-size:16px">We understand that introducing a new dicin=
g solution requires validation. That=E2=80=99s why we are happy to offer </=
span><strong><span style=3D";font-family:Calibri">sample dicing trials, pro=
cess consultation</span></strong><span style=3D";font-family:Calibri;font-s=
ize:16px">, and detailed specs to support early-stage evaluation if needed.=
</span></p><p style=3D"margin-top:7px;margin-right:0;margin-bottom:7px;marg=
in-left:0;margin-top:auto;margin-bottom:auto;text-align:left"><span style=
=3D";font-family:Calibri;font-size:16px">Please let us know if your team is=
 currently reviewing new equipment or would be open to exploring alternativ=
e cutting technologies.</span></p><p style=3D"margin-top:7px;margin-right:0=
;margin-bottom:7px;margin-left:0;margin-top:auto;margin-bottom:auto;text-al=
ign:left"><span style=3D";font-family:Calibri;font-size:16px">Looking forwa=
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